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2026 IEEE the 6th International Conference on Software Engineering and Artificial Intelligence (SEAI 2026)

Fuzhou, China | 19th June 2026 - 21st June 2026

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2026 IEEE the 6th International Conference on Software Engineering and Artificial Intelligence (SEAI 2026)

19th June 2026 – 21st June 2026
Fuzhou, China
Publication: All accepted and presented papers after proper registration and presentation, will be published into Conference Proceedings, which will be included by IEEE Xplore and submitted for Ei Compendex and Scopus, like last few years.

Conference Highlights

Ei-SEAI 2026>>Fuzhou, China


Welcome to 2026 6th International Conference on Software Engineering and Artificial Intelligence (SEAI) during June 19-21, 2026, hosted in Fuzhou, China. Co-sponsored by Fuzhou University and IEEE, hosted by the College of Computer and Data Science/College of Software (Fuzhou University), College of Computer Science and Technology (Huaqiao University) and Fujian Computer Society, co-hosted by College of Computer and Information Science (Fujian Agriculture and Forestry University, China).
SEAI 2026 provides a global platform for academics, researchers, and scientists to exchange insights on cutting-edge topics such as Artificial Intelligence & Applications, Software Engineering Techniques and Production Perspectives, Software Engineering Methodologies, Software & System Quality of Service, and Software & System Security.
Expect engaging keynote speakers, thought-provoking presentations, and interactive sessions, offering a unique opportunity to explore the latest advancements in AI and Software Engineering. Whether you're contributing a paper or attending as a presenter or listener, join us in Fuzhou for an intellectually stimulating and culturally enriching experience!
欢迎参加2026年第6届软件工程与人工智能国际会议(SEAI), 将于2026年6月19-21日在中国福州举办, 此次会议由福州大学主办, 福州大学计算机与大数据/软件学院, 华侨大学计算机科学与技术和福建省计算机学会承办, 福建农林大学计算机与信息学院协办! SEAI 2026旨在搭建软件工程与人工智能领域高端前沿交流平台,促进海内外专家学者的交流与合作,推动产业发展。本次会议将汇聚知名专家、学者和产业界优秀人才,共同围绕国际热点话题、核心关键技术、 产业发展及挑战等进行开放式研讨。热忱欢迎广大同仁踊跃投稿并莅临本次会议。

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