Date :
Place : Korea (south), Seoul
Website :http://www.iciea.org/
Contact Person:Dr. Serene Lo
Description:
Publication: Accepted and presented papers will be published by Springer Conference Proceedings (Electronic ISSN: 2195-4364; Print ISSN: 2195-4356), included in EI Compendex, SCOPUS, etc. main digital base.Deadline for abstracts/proposals : 25th January 2025
Organized By :
Keynote Speakers :
Conference Highlights :ICIEA 2025
ICIEA is the leading conference to
disseminate, to all branches of industries, information on
the most recent and relevant research, theories and
practices in ICIEA. All submissions are subjected to
rigorous review before an acceptance decision is made. This
conference has been attended by more than 1000 participants
from 50 countries since 2014 and was successfully held in
major cities such as Sydney, Singapore, Hong Kong, Nagoya,
Tokyo, Phuket Island, etc.
2025 12th International Conference on Industrial Engineering and Applications (ICIEA 2025), is to be held in
Seoul, Korea during April 24-27, 2025.It's co-sponsored by Science and Engineering Institute (SCIEI),
Korea University, National University of Singapore, Asia University, Patron with Macau University of Science and Technology,
Western Washington University, etc. The topics related to
reporting advances in industrial engineering theory, techniques,
methodology, applications and practice; general surveys and
critical reviews; announcements; etc. will be pondered on,
through the interactions between academic researchers from
different regions and cultures. Timely research topics will be
discussed via presentations of the latest progresses and
developments of Industrial Engineering and Applications for
solving social problems.
For the first time ever, we would unparalleled opportunities to
interact and network with qualified professionals from
throughout the world.
Accepted and presented papers will be published bySpringer Conference Proceedings-LNME, included inEI Compendex, SCOPUS, etc. main digital
base.
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Check the event website for more details.